KUALA LUMPUR, Oct 30 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has added ‘TC35681IFTG’ – a new IC for automotive applications to its line-up of ICs compliant with Bluetooth® low energy (LE) core specification v5.0.
According to Toshiba in a statement, the highly expandable and integrated device is also expected to be fully AEC-Q100 qualified in the 2019 spring.
The new IC will deliver a wide operating temperature range, high RF transmission power and high RF reception sensitivity.
The mixed-signal TC35681IFTG contains both analog RF and baseband digital parts to provide a complete solution on a single chip.
When used in conjunction with an external non-volatile memory, the new IC becomes a fully-fledged application processor that temporarily loads applications and stores in internal RAM (76KB). It can also be combined with an external host processor.
Current applications include Remote Keyless Entry, On-Board Diagnostics to collect sensor data, Tire Pressure Monitoring Systems and other contributors to improved vehicle comfort and safety.
-- BERNAMA
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