BILLERICA, Mass., Jan 27 (Bernama) -- Entegris, Inc. (NASDAQ:ENTG), a
leader in yield-enhancing materials and solutions for highly advanced
manufacturing environments, today announced new post-chemical mechanical
planarization (post-CMP) cleaning solutions for semiconductor
manufacturing. The new PlanarClean® AG family of products were designed
for use in 10 nm processes and below, and add to Entegris' leading
portfolio of post-CMP cleaning solutions.
"Entegris has been the industry leader in post-CMP cleaning for many
years. Our PlanarClean family products have been widely used in wafer
fabs around the world. To address greater complexity of wafer production
at the leading-edge nodes due to the addition of many new materials,
such as cobalt and tungsten, we carefully re-formulated our PlanarClean
solution to provide superior cleaning without damaging advanced films or
new materials," said Cuong Tran, director of post-CMP cleans for
Entegris. "PlanarClean AG meets the needs for advanced processes, while
also conforming to new safety guidelines outlined by our customers."
http://www.bernama.com/bernama/v8/newsindex.php?id=1210605
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